Housing with integrated circuit, light micrograph. The image shows an opened transistor outline (TO) metal housing with the mounted semiconductor chip. TO packages consist of a TO base and a TO cap. The TO socket forms the base for mounting the encapsulated semiconductor component and supplies it with power. The semiconductor in this image is a 741 operational amplifier, manufactured in 1980. Golden bond wires connect the pins of the TO base with the semiconductor chip. Microscopic contrast method: incident darkfield. Magnification: x80 when printed at 10 centimetres wide.
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Details
Creative#:
TOP27944570
Source:
達志影像
Authorization Type:
RM
Release Information:
須由TPG 完整授權
Model Release:
N/A
Property Release:
N/A
Right to Privacy:
No
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