A processed silicon wafer containing hundreds of micromechanic pressure sensors. Tweezers are being used to take sensors from the film backing to a 'chip tray' for final mounting. Micromechanics is the method by which tiny mechanical devices are made by a silicon deposition process similar to that used to manufacture microcircuits. The sensors are made on a substrate, or base, of silicon. The wafer is cut into sections during the process, each of which contains a single device. The wafer is backed with a plastic film to keep the sections together. These pressure sensors are destined for use in a car engine on-board performance monitoring system.
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Details
Creative#:
TOP10230200
Source:
達志影像
Authorization Type:
RM
Release Information:
須由TPG 完整授權
Model Release:
N/A
Property Release:
N/A
Right to Privacy:
No
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